Focus Laser
1 / 5
Revolutionize your PCB manufacturing process with our state-of-the-art Dual-Head Roll-to-Sheet (Roll-to-Roll) Coating Film Laser Cutting Machine. Engineered specifically for the electronic circuit industry, this equipment replaces traditional mechanical punch die and solder mask backfill processes with advanced non-contact laser technology.
Eliminate the need for expensive punch dies. Our laser technology handles complex patterns easily, reducing production lead time and costs associated with tooling maintenance.
Integrated automation system: automatic feeding, high-speed cutting, counting, part number replacement, trimming, and product collection in one flow.
Achieve superior cutting quality with neat edges, no burrs, and no blackening. Capable of handling line spacing over 50um without short circuits.
| Laser Type | Nanosecond UV, Picosecond UV, Nanosecond green laser |
|---|---|
| Processing Area | 2X250mmX500mm (customized) |
| Machine Dimensions | 2350mmX1450mmX2200mm |
| Processing Accuracy | ± 0.03mm |
| Total Power Consumption | 3 KW |
| Machine Weight | 2000 KG |
| Extra-large Table Size | 520mm x 2200mm |
| Environment Requirements | Temperature: 22°C ± 2°C; Humidity: 30%~60% |
Ideal for cutting Coverlay, Overlayer, and protective films in the following sectors:
Specializing in independent research and development of laser generators, optical devices, and automation system integration. We provide innovative solutions for laser micromachining applications, including processing technology, laser sources, and optical systems.
Our team creates value for industries such as printed circuit boards, consumer electronics, semiconductors, glass, new energy power batteries, and solar energy.
Packing: 1 PCS/Wooden Case
Shipping Method: Primarily by sea due to weight; international express is available for urgent requirements.
Delivery Time: Standard goods: 30-45 days; Customized goods: 45-60 days after confirmation.
