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| Laser Type | Picosecond UV / Nanosecond UV |
| Processing Area | 500mm x 680mm (Customized) |
| Machine Size | 1700mm x 1650mm x 1850mm |
| Processing Accuracy | ±0.02mm |
| Machine Power | 3.5KW |
| Environment | Temp: 22ºC ± 2; Humidity: 30% to 60% |
Smartphones, tablets, wearable devices (smartwatches, TWS headphones), notebooks, and VR devices. FPC cover film window opening and shape cutting for screen cables, foldable screen circuits, and camera modules.
Vehicle-mounted camera and sensor wiring harnesses, Battery management systems (BMS), charging systems, and intelligent cockpits including HUD and Lidar.
Endoscopes, portable diagnostic devices, and wearable medical monitors requiring miniaturization and flexible circuit boards.
Flexible circuit boards used in extreme environments requiring anti-vibration and thermal resistance. Precision machining of PCB/PCBA and ABF substrates.