Precision Coverlay Laser Cutting Machine Burr-Free 50um Fine Line Spacing Picosecond UV & Green Laser System

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Precision Coverlay Laser Cutting Machine Burr-Free 50um Fine Line Spacing Picosecond UV & Green Laser System

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Product Description

Basic Information

Model NO.

MLPC30A-C

Application

Home Appliance, Petroleum Machinery, Aerospace, Automotive, FPC, PCB, 5G Materials, Flexible OLED.

Cooling System

Water Cooling

Technical Class

Pulse Laser

Applicable Material

Nonmetal

Laser Technology

Ultrafast Laser

Certificates

CE, ISO9001

Production Capacity

100 sets/Month

Product Description

Precision Coverlay Laser Cutting Machine

Precision Coverlay Laser Cutting System

Engineered for elite electronics manufacturers, this system solves industry challenges: micro-fine line spacing, edge burrs, and thermal damage. By utilizing advanced Picosecond UV & Green Laser sources, we achieve a "Cold Cutting" effect that traditional punch dies cannot match.

This machine ensures zero stress, zero carbonization, and perfect edge quality for high-density FPCs and Coverlays.

Key Highlights

💎

50um Ultra-Fine Spacing
Stable and reliable even when processing dense line spacing over 50um, eliminating the risk of short circuits.

✨

Burr-Free & Carbonization-Free
The ultra-short pulse duration removes material before heat diffuses, maintaining the original color of the material.

📊

Power Stability System
Internal automatic measurement and optimization monitors energy in real-time to ensure consistent quality across thousands of pieces.

Application Areas

🎯

High-Density FPC (Flexible Printed Circuits)

🎯

Coverlay & Overlayer Cutting

🎯

Polyimide Film Processing

🎯

Precision Electronics Components

Technical Specification

Laser Type	Nanosecond UV, Picosecond UV, Nanosecond Green Laser
Processing Area	2 x 250mm x 500mm (customized available)
Machine Dimensions	2350mm x 1450mm x 2200mm
Processing Accuracy	± 0.03mm
Total Power Consumption	3 KW
Machine Weight	2000 KG
Environment Requirements	Temp: 22°C ± 2°C; Humidity: 30%~60%

Research & Development Capability

We are a technology-oriented enterprise specializing in the independent research and development of laser generators, optical devices, and automation systems.

We provide innovative solutions for laser micromachining including processing techniques, laser sources, and technical support across consumer electronics, semiconductors, and new energy sectors.

Packing & Delivery

📦

Packing: 1PCS per Wooden Case.

🚢

Shipping: Recommended by sea due to weight (2000kg+). Express available for urgent needs.

📅

Delivery: Standard goods: 30-45 days; Customized goods: 45-60 days after deposit.

Our Clients

Frequently Asked Questions

What materials can this laser machine cut?

This machine is specifically designed for non-metal materials including FPC (Flexible Printed Circuits), Coverlays, Polyimide (PI) films, and other materials used in flexible OLED displays and 5G communications.

What is the advantage of Picosecond UV over Nanosecond laser?

Picosecond lasers have an ultra-short pulse duration, which creates a "cold cutting" effect. This ensures burr-free edges and zero carbonization (no blackening), which is critical for high-precision electronic components.

What is the processing accuracy of the MLPC30A-C?

The machine offers a high processing accuracy of ± 0.03mm, making it suitable for high-density interconnects and fine line spacing as small as 50um.

Is the laser power stable during long production runs?

Yes, the machine features a built-in internal power stability system that automatically measures and optimizes laser energy in real-time to ensure the first and last pieces have identical quality.

How is the machine protected during international shipping?

The machine is packed in a robust, export-standard wooden case to protect it from mechanical stress and moisture during sea or express transport.

What are the environmental requirements for operation?

For optimal performance and accuracy, the machine should be operated in a temperature-controlled environment of 22°C ± 2°C with non-condensing humidity between 30% and 60%.