Focus Laser
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In the competitive landscape of advanced electronics, precision and efficiency are paramount. Traditional drilling methods can no longer meet the demands of high-density interconnect (HDI) boards, IC substrates, and fragile materials. The U30 is engineered to overcome these challenges. As a specialized piece of laser equipment, it utilizes cutting-edge UV picosecond technology to perform high-precision drilling and de-gluing (ablation) on PCBs, setting a new standard for quality and productivity in modern manufacturing.
Our UV picosecond laser creates an ultra-short pulse, confining the heat-affected zone (HAZ) to less than 5μm. This "cold ablation" process eliminates thermal damage, micro-cracks, and delamination.
Reach a production capacity of 10,000 holes per minute. The system's AI-driven path optimization minimizes idle time and maximizes throughput, drastically lowering your cost-per-part.
As a non-contact system, there are no mechanical tools to wear out or replace. This means virtually zero consumable costs and minimal maintenance.
Achieve a consistent production yield of over 98% thanks to our advanced auto-compensation system. The U30 handles FR-4, high-frequency laminates, flexible circuits (FPC), and glass.
With a standard 550mm x 600mm processing area, it handles large panels with ease. Customization is available to adapt to specific production workflows.
| Product Name | U30 PCB Coverlay Opening Laser Machine |
| Laser Type | UV Picosecond |
| Processing Area | 550mm x 600mm (Customization Available) |
| Machine Accuracy | ±0.02mm |
| Electric Power Loading | 6.5KW |
| Machine Dimensions | 2500mm x 2200mm x 1900mm |
| Machine Weight | 5000KG |
| Environment Requirements | Temp: 22℃ ± 2℃ / Humidity: 30%~60% |
We specialize in the independent research and development of laser generators, optical devices, and equipment application processes. With a team where over 41% are R&D personnel (including senior engineers and PhD experts), we provide innovative solutions for laser micromachining.
