U30 Picosecond Laser System for Advanced Micro-Drilling & Cold Ablation

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U30 Picosecond Laser System for Advanced Micro-Drilling & Cold Ablation

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Product Description

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Basic Specifications

Model NO.

U30

OEM & ODM

Accepted

Certificates

CE, ISO9001

Transport Package

Wooden Case

Origin

China

Capacity

100 sets/Month

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U30 Picosecond Laser System

Advanced Micro-Drilling & Cold Ablation Technology

In the competitive landscape of advanced electronics, precision and efficiency are paramount. Traditional drilling methods can no longer meet the demands of high-density interconnect (HDI) boards, IC substrates, and fragile materials. The U30 is engineered to overcome these challenges using cutting-edge UV picosecond technology to perform high-precision drilling and de-gluing on PCBs.

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Why Choose the U30?

Damage-Free Processing

UV picosecond laser creates ultra-short pulses, confining the heat-affected zone (HAZ) to less than 5μm, eliminating thermal damage and micro-cracks.

AI-Enhanced Efficiency

Reaches a capacity of 10,000 holes per minute. AI-driven path optimization minimizes idle time and maximizes throughput.

Zero Tool Wear

As a non-contact system, there are no mechanical tools to replace, ensuring maximum uptime and lower total cost of ownership.

Broad Compatibility

Capable of processing FR-4, high-frequency laminates, flexible circuits (FPC), and specialty substrates like glass.

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Technical Specifications

Product Name	U30 Picosecond Laser System
Laser Type	UV Picosecond
Processing Area	550mm x 600mm (Customization Available)
Machine Accuracy	±0.02mm
Electric Power Loading	6.5KW
Dimensions (L×W×H)	2500mm x 2200mm x 1900mm
Machine Weight	5000KG
Environment	Temp: 22℃ ± 2℃ / Humidity: 30%~60%

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Application Areas

🔹 HDI & Microvia PCB Drilling
🔹 IC Substrate Manufacturing
🔹 FPC De-gluing & Ablation
🔹 Advanced Packaging
🔹 Precision Micromachining
🔹 Glass & Ceramic Substrates

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Research & Development Excellence

Our technology-oriented enterprise specializes in independent research of laser generators, optical devices, and automation system integration.

With over 41% of staff dedicated to R&D, including senior engineers and laser experts, we maintain strong capabilities in developing custom laser solutions for printed circuit boards, semiconductors, and new energy industries.

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Packing & Delivery

Packing: 1 Set per Wooden Case

Shipping: Sea freight is recommended due to weight. International express available for urgent needs.

Delivery Time: 30-45 days for standard models; 45-90 days for customized systems.

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Trusted By Global Clients

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Frequently Asked Questions

What materials can the U30 laser system process?

The U30 is highly versatile and can process FR-4, high-density interconnect (HDI) boards, flexible printed circuits (FPC), IC substrates, glass, ceramic, and various other specialty substrates.

What is "cold ablation" and why is it beneficial?

Cold ablation uses ultra-short picosecond pulses to vaporize material without significant heat transfer. This limits the heat-affected zone (HAZ) to under 5μm, preventing thermal damage, charring, or delamination of sensitive circuits.

How does the AI-driven optimization improve production?

Our AI algorithms optimize the laser's travel path to minimize idle time between holes. This allows the system to reach drilling speeds of up to 10,000 holes per minute, significantly increasing throughput.

Does the machine require frequent tool replacements?

No. Since it is a non-contact laser system, there are no mechanical drill bits to wear out or break. This results in zero consumable tool costs and significantly higher uptime compared to mechanical drilling.

Can the processing area be customized for larger panels?

Yes. While our standard processing area is 550mm x 600mm, we offer full customization services to adapt the machine dimensions to your specific production workflow and panel size requirements.

What is the expected lead time for a new order?

Standard machines typically ship within 30-45 days after deposit. For fully customized systems, the lead time is generally between 45 and 90 days, depending on the complexity of the requirements.