Core application scenarios including smartphones, tablets, wearable devices (smartwatches, TWS headphones), notebooks, and VR devices. Handles FPC cover film window opening, shape cutting, and flexible connection lines.

Rapidly growing demand in new energy vehicles for camera/sensor wiring harnesses, Battery Management Systems (BMS), intelligent cockpits, and autonomous driving components like Lidar.

Miniaturization and flexibility for endoscopes, portable diagnostic devices, and wearable medical monitors such as dynamic ECG monitors.

Scenarios requiring extreme precision and reliability, including aerospace flexible circuit boards and micro-structure trimming of ABF substrates.

Polymer material processing (PET, PI, PP), fingerprint chip modules, and high-precision electronic tapes. Supports 100% yield rate with small pad sizes (0.15mm).